IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems

16 - 19 January 2022
Las Vegas, Nevada, USA

IEEE Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems have been at the forefront of moving Silicon technologies into microwave and millimeter-wave applications – a development now widely accepted, and of great importance. RF CMOS and Si/SiGe BiCMOS technologies are well established in commercial and increasingly also military applications.

SiRF2022 will mark the 22nd topical meeting on SiRF, with a renewed emphasis on promoting a dialogue between IC designers and researchers promoting non-standard technologies, exploiting the maturity of Silicon processes, but addressing the challenges of tomorrow. The three days of SiRF2022 will chronicle recent advances in our dynamic field, and provide the platform for developing new ideas, and candid exchange, facilitated by SiRF's single-session format. As in past years, a line-up of reputed invited speakers will stimulate our discussions, with an emphasis on emerging technologies.

SiRF2022 solicits papers in the following focus areas:

  • Circuits:
    Microwave, mm-wave, THz and mixed-signal building blocks and multi-functional ICs, integrated transceivers, high-speed DACs and ADCs, RFICs, reconfigurable micro-/mm-wave ICs.
  • Applications:
    System-on-Chip (SoC) and System-in-Package (SiP), ultra-wideband (UWB) frontends, wireless sensor networks, intelligent antennas and antenna array solutions, emerging telecom (e.g. 60 GHz WLAN, E-band, 5G) and sensor systems (automotive, security, health monitoring), radio over fiber.
  • Si photonics:
    Si-based photonic components, integration with electronic circuits, new circuit and system     architectures based on PIC and EPIC technologies.
  • Technology and materials:
    Nano-technologies including CNT, nanowire and graphene; Si-based heterostructures, advanced RF CMOS and Si/SiGe BiCMOS including through-Si vias integration; RF MEMS and micromachining, advanced packaging, epitaxy, strain engineering, characterization, stability issues, smart materials.
  • Measurement and Modeling:
    Multi-physics modeling, EM simulation of complex RFICs, robust measurement and de-embedding, built-in self-test, self-calibration, high-throughput RFIC testing.

We will continue posting updates and information about the conference on this website. Make sure you visit this website frequently to keep track with the latest news about SiRF2022!

Call for Paper (SiRF2022) can be found here.