IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems

16 - 19 January 2022
Las Vegas, Nevada, USA

IEEE Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems have been at the forefront of moving Silicon technologies into microwave, millimeter-wave and THz applications – a development now widely accepted, and of great importance. RF CMOS and Si/SiGe BiCMOS technologies are well established in commercial and defense applications.

SiRF 2022 will mark the 22nd topical meeting on SiRF, with a renewed emphasis on promoting a dialogue between IC designers and researchers promoting non-standard technologies, exploiting the maturity of Silicon processes, but addressing the challenges of tomorrow. The three days of SiRF 2022 will chronicle recent advances in our dynamic field, and provide the platform for developing new ideas, and candid exchange, facilitated by SiRF’s single-session format. As in past years, a line-up of reputed invited speakers will stimulate our discussions, with an emphasis on emerging technologies.

SiRF 2022 solicits papers in the following focus areas:

1. RF, Millimeter-wave and THz Integrated Circuit Front ends

  • Integrated Transceivers and Transceiver sub-systems
  • MIMO and Phased Array Integrated Circuits
  • Ultra-Wideband Front ends and Building Blocks
  • Emerging Technologies, 5G and 6G Front ends
  • mmw & THz Imaging Circuits
  • System-on-Chip and System-on-Package
  • Smart Antennas and Integrated Meta-Surfaces
  • RF, mmW and THz Circuit Building Blocks
  • Reconfigurable Radio Front ends
  • Wireless Sensors and Sensor Systems
  • Low Power RFIC for Biomedical Applications

2. Wireline Communication Circuits and Building Blocks

  • Wideband Transmitter, Receiver and Transceivers
  • High Frequency Oscillators and Signal Generators
  • PLLs and Frequency Synthesizer Integrated Circuits
  • Clock and Data Recovery Circuits
  • Precise Timing Circuits
  • High-Speed Modulators and Drivers

3. High Speed Data Converters & Mixed Signal Circuits

  • Nyquist Rate and Oversampling A/D and D/A Converters
  • Embedded & Application-Specific A/D and D/A Converters
  • Analog to Information Conversion
  • Time-to-Digital Converters
  • Analog Circuits and Building Blocks
  • Digitally Assisted Analog Circuits and Analog Calibration
  • MEMS/sensor Interface Circuits

4. Silicon Photonics and Electronic-Photonic Integrated Circuits

  • Wideband Electronic-Photonic Circuits
  • Electronic-Photonic Modulators
  • Electronic-Photonic Receives
  • Wideband TIAs and Drivers
  • LIDARS
  • Optical PLLs
  • Radio Over Fiber Circuits

5. Devices, Technology, Modeling and Materials

  • Advanced RF CMOS and SiGe BiCMOS Devices
  • Si-Based Heterostructures
  • Through-Silicon Via Integration
  • RF MEMs and Micromachining
  • Advanced Device Modeling
  • Advanced Packaging
  • Epitaxy
  • Strain Engineering
  • Characterization and Stability Issues
  • Smart Materials
  • Nano Technologies Including CNT, Nanowire and Graphene

6. Measurement and Modeling

  • Multi-Physics Modeling
  • EM Simulation of Complex RFICs
  • Robust Measurement and De-Embedding
  • Built-In Self-Test
  • Self-Calibration

We will continue posting updates and information about the conference on this website. Make sure you visit this website frequently to keep track with the latest news about SiRF 2022!

Call for Paper (SiRF 2022) can be found here.

SiRF 2022 Chair
Saeed Zeinolabedinzadeh, Arizona State University