IEEE Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) have been at the forefront of advancing silicon technologies for RF, millimeter-wave, and THz applications. RF CMOS and SiGe BiCMOS technologies are well established in a wide range of commercial and defense applications and are rapidly expanding to enable AI-enhanced RF systems and quantum computing. SiRF 2027, marking the 27th edition of the conference, introduces a renewed emphasis on emerging themes in artificial intelligence and quantum technologies, while continuing its strong focus on state-of-the-art RF/millimeter-wave integrated circuits. The conference creates an open, highly interactive dialogue between IC designers and researchers exploring emerging and non-traditional technologies – leveraging mature silicon platforms while addressing the challenges and opportunities of data-driven intelligence and quantum-era hardware. Over three days, SiRF 2027 will highlight recent advances in this dynamic field and provide a focused forum for new ideas and candid discussion through its single-session format. A distinguished lineup of invited speakers will further stimulate discussion with an emphasis on emerging technologies.
SiRF 2027 invites the submission of original papers in the following focus areas:
- AI and Quantum Computing for Emerging RF and Microwave Systems
- AI-Assisted and AI-Enabled RF/mm-Wave/THz Integrated Circuits
- ML-Based Built-In Self-Test (BIST), Calibration, and Adaptation
- Cryogenic RF and Microwave Integrated Circuits for Quantum Computing
- Silicon-Based Spin Qubit Control and Readout Electronics
- RF, Millimeter-Wave, and THz Integrated Circuits
- Integrated Circuits for B5G/6G Wireless Communication and Sensing Systems
- Multi-Band/Ultra-Wideband/Reconfigurable RF Front-Ends and Transceivers
- Oscillators, PLLs, and Frequency Synthesizers
- Frequency Converters, Modulators, Phase Shifters, and Multi-Throw Switches
- High-Speed ASICs for Wireline and Optical Communications
- Broadband Wireline/Optical Transmitters, Receivers, and Transceivers
- High-Speed/Broadband Front-Ends (TIA, Driver)
- Advanced Techniques for Equalization and Clock and Data Recovery (CDR)
- Silicon Photonics and Co-Packaged Optics (CPO)
- Device Technologies, Advanced Packaging, and Heterogeneous Integration
- Advanced bulk CMOS, SOI CMOS, FinFET, and SiGe BiCMOS Technology and Device Modeling
- 2.5D/3D IC Packaging and System-in-Package (SiP) Technologies
- Advanced Heterogeneous Integration Techniques
- Advanced High-Frequency Measurement and Characterization Techniques
