IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems

22 - 25 January 2023
Las Vegas, Nevada, USA
Conference Chair: Roee Ben-Yishay, Intel
Technical Program Chair: Robert Schmid, Johns Hopkins Applied Physics Lab
Technical Program Co-Chair: Mehmet Kaynak, IHP Microelectronics
Publicity Chair: Ickhyun Song, Hanyang University
International Liaison - Asia: Chien-Nan Kuo, National Chiao Tung University
International Liaison - Europe: Mehmet Kaynak, IHP Microelectronics
Executive Committee: Yi-Jan Emery Chen, National Taiwan University
Julio Costa, Qorvo
Vadim Issakov, University Magdeburg
Mehmet Kaynak, IHP Microelectronics
Eric Kerherve, University of Bordeaux
Dietmar Kissinger, Ulm University
Chien-Nan Kuo, National Chiao Tung University
Hao Li, Infineon Technologies
Donald Lie, Texas Tech University
Venkata Koushik Malladi, NXP Semiconductors
Monte Miller, NXP Semiconductors
Sergio Pacheco, NXP Semiconductors
Nils Pohl, Ruhr-Universität Bochum
Jae-Sung Rieh, Korea University
Hasan Sharifi, HRL Labs
Ahmet Cagri Ulusoy, Karlsruhe Institute of Technology
Václav Valenta, ESA/ESTEC