IEEE Radio & Wireless Week

16 - 19 January 2022
Las Vegas, Nevada, USA

Call for Papers for the IEEE Transactions on MTT Special Issue on the 2022 IEEE Radio & Wireless Week
(Expected Publication Date: October 2022)

The IEEE Transactions on Microwave Theory and Techniques (IEEE T-MTT) will publish a Mini-Special Issue devoted to the 2022 IEEE Radio & Wireless Week (RWW 2022), which will be held on January 16-19, 2022 in Las Vegas, Nevada USA. Authors of all papers relevant to topics of interest of T-MTT presented at the RWW 2022 are invited to submit an expanded version of their papers to the Mini-Special Issue. The expanded version requires that the new technical content includes a more in-depth treatment, new results beyond the RWW 2022 paper, or both. The authors should also take advantage of the discussions generated at the RWW 2022, which may lead to possibly different results or interpretations. Every paper will be reviewed by the T-MTT Editorial Board in the same manner as all other regular submissions to this publication. Therefore, authors of papers presented at the RWW 2022 are invited to submit a substantially expanded version of their papers to the Mini-Special Issue.

The submission should be accomplished through the ScholarOne Manuscript Central website. When preparing your manuscript, you should consult the Instructions for Authors and follow the T-MTT Word or LaTex Templates available there. Papers not following these templates cannot be accepted into the peer review process.

Please be aware that your contribution will be evaluated via the same peer-review process as any other regular T-MTT submission. The quality of your contribution must meet the level required for a publication at the MTT Transactions.

Since your contribution is an expanded version of your conference paper, it is important to note that, according to the instructions for authors, you must meet the following requirement:

“5. You must reference your own work, especially recent journal/conference publications. Discuss your related publications in the introduction and distinguish the new results you present in your current manuscript from those found in your previous publications. While there is not a specific criteria that must be met, such as 60% new technical material, the reviewers are asked to determine if the paper provides "sufficient new technical material to justify a new paper" when compared to all previously published papers. This standard must be met by all papers, including papers that are submitted to conference special issues. Note that longer introductions and lists of references do not qualify as "technical material." It is acceptable to repeat some results to properly explain the concept and to create a self-contained paper for the reader, but this should be done only when necessary. Please attach pdf files of the previous papers.”

Because of the time required for a second review cycle, papers receiving a major revision decision are not guaranteed to be published in the mini-SI, but may be published in a subsequent regular issue if, in the end, the paper is accepted.

In the unlikely event that the mini-Special Issue does not have enough accepted papers, it will be canceled and its accepted papers will be scheduled for publication in subsequent regular issues of the MTT Transactions.

Other submission instructions:

  1. In the pull-down menu for “Manuscript Type”, please select “RWW 2022 Mini-Special Issue”.
  2. Please note that only papers falling in the topics of interest of the MTT Transactions will be considered.
  3. The conference(s) paper(s) must be included along with the submission as a supplementary file.
  4. Discuss the expansion over the conference paper(s) in the Introduction (very important).
  5. The following note should be added to the footnote on the first page of the paper: “This paper is an expanded version from the IEEE Radio & Wireless Week, Las Vegas, Nevada USA, 16-19 January, 2022.

The due date for the paper submission is 15 March, 2022.
If you have any questions, please contact us at the following address:

Guest Editors

Changzhi Li
Texas Tech University, USA
changzhi.li@ttu.edu

Changzhan Gu
Shanghai Jiao Tong University, China
changzhan@sjtu.edu.cn