Distinguished Microwave Lecturers' Talks
Monday, 18 January 2021, 8:00am - 11:00am
Organizer: Markus Gardill, InnoSenT GmbH, Germany
Chip-Scale Wave-Matter Interactions at RF-to-Light Frequencies: Circuits, Systems and Applications
Speaker: Ruonan Han, MIT, USA
Traditional electromagnetic (EM) spectral sensors using integrated circuit technologies (e.g. automotive radars, security imagers, cameras, etc.) are normally based on remote wave scattering or absorption by macroscopic objects at remote distance; the operations are also not selective in wave frequencies. In the past couple of years, a new paradigm of chip-scale EM spectral sensing emerges with features complementary to the above: they utilize various modalities of interactions between EM waves with high-precision frequency control and microscopic particles (molecules, atoms, etc.) with close proximity to the chip. This progress is enabled by the recent advances of silicon devices and processes, as well as the extension of circuit operation frequencies into the terahertz regime. Chip-scale sensing and metrology systems with new capabilities, higher performance and unprecedented affordability now become possible. Examples include THz gas spectroscopy sensors, on-chip "atomic-clock-grade" frequency references, room-temperature CMOS-quantum magnetometers, etc. This talk will present the basic physics of the some wave-matter interactions, key enabling technologies, as well as the designs and prototypes of a few chip systems in the category described above. We will also discuss their potential applications in bio- chemical analysis, wireless networks, PNT (positioning, navigation & timing), security and so on.
Ruonan Han (S'10-M'14-S'19) received the B.Sc. degree in microelectronics from Fudan University, China , in 2007, the M.Sc. degree in electrical engineering from the University of Florida, Gainesville, FL, USA, in 2009, and the Ph.D. degree in electrical and computer engineering from Cornell University, Ithaca, NY, USA, in 2014. In 2012, he was an intern with Rambus Inc., Sunnyvale, CA. He is currently an associate professor with the Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA. His current research interests include microelectronic circuits and systems operating at millimeter-wave and terahertz frequencies. Dr. Han is a member of the IEEE Solid-State Circuits Society (SSC-S) and the IEEE Microwave Theory and Techniques Society (MTT-S). He was a recipient of the Cornell ECE Directors Ph.D. Thesis Research Award, Cornell ECE Innovation Award, and two Best Student Paper Awards of the IEEE Radio-Frequency Integrated Circuits Symposium (2012 and 2017). He was also recipient of the IEEE MTT-S Graduate Fellowship Award, and the IEEE SSC-S Predoctoral Achievement Award. He is an associate editor of IEEE Transactions on Very-Large-Scale Integration (VLSI) System and a guest associate editor of IEEE Transactions on Microwave Theory and Techniques. He also serves on the Technical Program Committee (TPC) of IEEE RFIC Symposium and the TPC and Steering Committee of 2019 IEEE International Microwave Symposium (IMS). He is the winner of the Intel Outstanding Researcher Award (2019) and the National Science Foundation (NSF) CAREER Award (2017).
Fast Solvers for Electromagnetics-Based Analysis and Design of Integrated Circuits and Systems
Speaker: Dan Jiao, Purdue University, USA
The design of advanced integrated circuits and microsystems from zero to terahertz frequencies calls for fast and accurate electromagnetics-based modeling and simulation. The sheer complexity and high design cost associated with the integrated circuits and microsystems prevent one from designing them based on hand calculation, approximation, intuition, or trial and error. The move towards higher frequencies and heterogeneous technologies stresses the need even more. However, the analysis and design of integrated circuits and microsystems impose many unique challenges on electromagnetic analysis such as exponentially increased problem size and extremely multiscaled system spanning from nano- to centi-meter scales. Prof. Jiao will present recent advances in fast solvers to tackle these challenges.
Dan Jiao received her Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign, in 2001. She then worked at the Technology Computer-Aided Design (CAD) Division, Intel Corporation. In September 2005, she joined Purdue University, West Lafayette, IN, where she is now a Professor. She has authored over 300 papers in refereed journals and international conferences. Her current research interests include computational multiphysics, computational electromagnetics, high-frequency integrated circuit design and analysis.
Prof. Jiao has received many research awards including the 2013 S. A. Schelkunoff Prize Paper Award of the IEEE Antennas and Propagation Society, and the Intel's 2019 Outstanding Researcher Award. She is an IEEE Fellow and IEEE MTT-Society Distinguished lecturer.
Silicon-based Millimeter-wave Phased Arrays for 5G: Fundamentals to Future Trends
Speaker: Bodhisatwa Sadhu, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
5G cellular communications use millimeter-wave phased arrays to achieve high data rates and low latency. The majority of the 5G millimeter-wave infrastructure will be partially or completely based on silicon technology. This talk will discuss key aspects of silicon-based millimeter-wave phased-array module design and characterization. It will cover fundamentals of phased arrays, provide an overview of phased array antenna modules using silicon technology, and take a deep dive into an example 5G phased array antenna module. The talk will end with a peek into the future of 5G directional communications.
Bodhisatwa Sadhu received the B.E. degree in Electrical and Electronics Engineering from Birla Institute of Technology and Science - Pilani (BITS-Pilani) in 2007, and the Ph.D. degree in Electrical Engineering from the University of Minnesota, Minneapolis, in 2012.
He is currently a Research Staff Member with the RF/mm-wave Communication Circuits & Systems Group at IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, and an Adjunct Assistant Professor at Columbia University, NY. At IBM, he has led the design and demonstration of the world’s first reported silicon-based 5G phased array IC, a low power 60GHz CMOS transceiver IC for 802.11ad communications, a software-defined phased array radio, and a self-healing 25GHz low noise frequency synthesizer. He has authored and co-authored 15+ journal papers, 30+ conference papers, the book Cognitive Radio Receiver Front-Ends-RF/Analog Circuit Techniques (Springer, 2014), and several book chapters. He holds 20 issued U.S. patents with 20+ pending. Dr. Sadhu currently serves as an IEEE MTT-S Distinguished Microwave Lecturer, the RFIC Systems Applications sub-committee chair of IEEE RFIC Symposium, TPC member of Wireless Subcommittee at IEEE ISSCC, and has served as a Guest Editor of IEEE JSSC in 2017.
Dr. Sadhu is the recipient of the 2017 ISSCC Lewis Winner Award for Outstanding Paper (best paper award), the 2017 JSSC Best Paper Award, the 2017 Pat Goldberg Memorial Award for the best paper in computer science, electrical engineering, and mathematics published by IBM Research, three IBM A-level Accomplishment awards, nine IBM Patent Plateau Awards, the University of Minnesota Graduate School Fellowship in 2007, 3M Science and Technology Fellowship in 2009, the University of Minnesota Doctoral Dissertation Fellowship in 2011, the BITS Pilani Silver Medal in 2007, the BITS Pilani Merit Scholarship from 2004 to 2007, and stood 2nd in India in the Indian School Certificate (ISC) examination in 2003. He was recognized as an IBM Master Inventor in 2017, and was selected by the National Academy of Engineering for its Frontiers of Engineering Symposium in 2020.
Towards Universally Programmable Chip-scale THz Source, Sensors and Systems: Bridging the THz and Application gap in the Next Decade
Speaker: Kaushik Sengupta, Princeton University, USA
Silicon-based Terahertz systems is a field that is only about a decade old. In this time, we have seen a phenomenal growth of silicon systems operating at THz frequencies for a wide range of applications in sensing, imaging and communication. It can be argued that both the 'THz gap' and the 'technology and applications gap' is closing in meaningful ways in the THz range. Technologies beyond 100 GHz focusing on sensing, imaging and wireless back-haul links are getting attractive as we enter into a new area of highly dense network of autonomous systems requiring ultra-high speed and reliable links.
In order to move beyond this inflection point as Moore's law continue to slow, I will discuss why we need to look beyond the classical 'device'-level metrics of efficiency and sensitivity of THz sources and detectors towards holistic 'system' level properties such as scalability and programmability. Such properties are critically important for applications in sensing and imaging, as evidenced across sensor fusion technologies across mmWave, IR and optical frequencies. The ultimate programmability in THz sources and sensors is one that can synthesize or receive THz fields with arbitrary configuration and spectrum. In this talk, I will highlight approaches that cut across electromagnetics, circuits, systems and signal processing, to allow for such reconfigurability in THz signal synthesis and sensing, yet realized with devices that are themselves not very efficient. Particularly, we will demonstrate approaches to THz CMOS sensors reconfigurable across the three field properties of spectrum (100 GHz-1000 GHz), beam pattern and polarization, programmable THz metasurfaces with CMOS tiling, and enabling dynamic spectrum shaping and physically secure sub-THz links.
Kaushik Sengupta received the B.Tech. and M.Tech. degrees in electronics and electrical communication engineering from IIT Kharagpur, Kharagpur, India, in 2007, and the M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology (Caltech), Pasadena, CA, USA, in 2008 and 2012, respectively. He performed research with the University of Southern California, Los Angeles, CA, USA, and the Massachusetts Institute of Technology, Cambridge, MA, USA, in 2005 and 2006, where he was involved in nonlinear integrated systems for high-purity signal generation and low-power RF identification tags. He joined as a Faculty Member the Department of Electrical Engineering, Princeton University, Princeton, NJ, USA, in 2013. His current research interests include high-frequency ICs, electromagnetics, and optics for various applications in sensing, imaging, and high-speed communication.
Dr. Sengupta received the DARPA Young Faculty Award in 2018, the Bell Labs Prize in 2017 and Young Investigator Program Award from Office of Naval Research in 2017. He received the E. Lawrence Keys, Jr./Emerson Electric Co. Junior Faculty Award from Princeton School of Engineering and Applied Science in 2018 and the 'Excellence in Teaching Award' in 2018 nominated by the Undergraduate and Graduate Student Council in Princeton School of Engineering and Applied Science. He was six times selected to the Princeton Engineering Commendation List for Outstanding Teaching. He was the recipient of the Charles Wilts Prize in 2013 from Electrical Engineering, Caltech for the best Ph.D. thesis.
He is the co-chair of the Emerging Technologies Sub-committee in IEEE Custom Integrated Circuits conference (CICC), serves on the technical program committees in IEEE International Microwave Symposium, and previously served in similar roles in IEEE European Solid-state Circuits Conference (ESSCIRC) and Progress in Electromagnetics Research (PIERS). He was the co-recipient of the IEEE RFIC Symposium Best Student Paper Award in 2012 and co-recipient of the 2015 Microwave Prize from IEEE Microwave Theory and Techniques Society. He is a member of the MTT-4 Committee on Terahertz technology, a Distinguished Lecturer for IEEE Solid-State Circuits Society from 2019-2020, and Distinguished Lecturer for IEEE Microwave Theory and Techniques from 2021-2023.