IEEE Radio & Wireless Week

22 - 25 January 2023
Las Vegas, Nevada, USA

Date & Time: Sunday, 16 January 2022, 18:00

At the Women in Microwave (WiM) event, we will put the spotlight on distinguished women in microwaves, who advanced the field of Microwaves Theory and Techniques.

Distinguished women in microwaves will give a review talk of the specific research topic they are working in and advancing. From today’s view, the following distinguished women in microwaves will present their research:

The WiM event at IEEE RWW 2022 will be sponsored by the Microwave Theory and Techniques Society (MTT-S), the Automatic Radio Frequency Techniques Group (ARFTG), and the MTT-S Women in Microwaves Subcommittee.


How Does a Metasurface Become a Good Antenna?

Speaker: Prof. Wenquan Che, South China University of Technology, China


Due to some unique features for manipulating electromagnetic waves, metamaterials/metasurfaces have attracted extensive attention and been widely applied for antenna performance enhancement. This talk, most of whose contributors are women, will detail research into metasurfaces. First, electromagnetic characteristics manipulation by metasurfaces will be presented. Second, several metasurface-based antennas will be described, demonstrating significant improvement in the metasurface structures’ performance. These metasurface-based antennas have great application potential for advanced wireless communication systems.


Integrated Circuits and Their Hetero-Integration for Future Radar and Communication Systems

Speaker: Prof. Amelie Hagelauer, Technical University of Munich/Fraunhofer Research Institute for Microsystems and Solid State Technologies, Germany


In times of increasing digitalization in many areas of our daily life, microelectronic systems play a crucial role. For example, autonomous driving; future generations of mobile phones, such as 5G/6G; and Industry 4.0 require a large number of electronic circuits and sensors. This presentation will take a more detailed look at important research areas for these future systems. First, an overview of research in materials and circuits concepts for 5G mobile radio filters will be given. Afterward, RF frontend components for 5G/6G systems will be presented. Finally, the address will demonstrate the advantages of heterointegration for such systems.


Integration and Packaging Strategies for Millimeter-Wave CMOS

Speaker: Prof. Rashaunda M. Henderson, University of Texas at Dallas, USA


Millimeter-wave CMOS circuits are being developed for consumer products operating up to 100 GHz and beyond. Applications include 77-GHz automotive radar, circuits operating from 200 to 300 GHz in spectrometers for gas analysis, and 180—315-GHz wireless and wireline circuits for high-data-rate centers. High-frequency designs have the benefit of providing more bandwidth for communication systems. While the design of active components and subcircuits has been explored by many research groups, there is still a need to provide integration and packaging strategies that remain low in cost and high in performance.

This presentation will cover results related to integrating CMOS circuits using post-CMOS and printed circuit board techniques. A 200—300-GHz spectrometer design will be presented with interconnects and antennas printed on low-loss polymers. In addition, results from on-chip passive components and antennas designed for a 120 Gb/s wireline system will be described. The on-chip antennas are used to excite a broadband dielectric waveguide. Electromagnetic simulation studies and measured results will be detailed for these application areas. To facilitate the accurate design of passive components, high-frequency material characterization is needed. This work will include results on the dielectric properties of the packaging substrates utilized in the frequency ranges mentioned.