Joint RWW/ARFTG Plenary Session
Wednesday, 19 January 2022 8:00 - 9:45
Artificial Intelligence and Machine Learning for the era of Hyperconnected IoT Devices
Speaker: Dr. Frank Schirrmeister, Cadence
We are at the cusp of an Era of Hyperconnectivity and Hyperscale Computing, fueled by billions of devices in the Internet of Things (IoT) and its industrial sibling, the Industrial IoT (IIOT). Ericsson predicts that data traffic through commercial networks grows to 164 exabytes per month in 2025. Video already accounted for 63% of the traffic of 2019’s 33 exabytes per month and will become 76% of the estimated 164 exabytes per month in 2025. At that time, 5G adoption could reach 2.8 billion subscriptions, and 5G population coverage is forecast at 55%. Seagate and IDC predict storage in the “global datasphere” to grow to 175 zettabytes by 2025, up from 45 zettabytes in 2019.
This presentation will discuss requirements for designing systems on chips (SoCs) and systems enabling the era of Hyperconnectivity. Specifically, we will and introduce solutions that the Electronic Design Automation (EDA) industry provides today for Artificial intelligence (AI) and machine learning (ML), as well as trends to address future challenges. In addition, we will also discuss how AI/ML technologies increase development productivity and optimize EDA design processes.
Specifically, we will discuss enabling processor and design IP and high-level synthesis to enable optimized circuitry for AI/ML algorithms. Furthermore, we will introduce the requirements for optimized AI/ML designs and specific verification tools for this design category. Advanced node and low power implementation are vital to linking verification to SoC implementation, and we will discuss particular optimizations and 3DIC and Chiplet based integration and analysis. To utilize AI/ML for EDA, we will introduce trends and experiences using AI/ML for formal verification, simulation, and implementation.
Frank Schirrmeister is senior group director, solutions & ecosystem at Cadence. He leads a team translating customer challenges in the hyperscale, communications, consumer, automotive, aerospace/defense, industrial, and healthcare vertical domains into specific requirements and solutions. In addition, his team focuses on cross-product technical solutions such as 5G, artificial intelligence, machine learning, safety, security, digital twins, and partner collaborations. Frank holds a Dipl.-Ing. in electrical engineering from the Technical University of Berlin, Germany. Before joining Cadence, Frank held senior engineering and product management positions in embedded software, semiconductor, and system development, both in Europe and the United States.