IEEE Radio & Wireless Week

19 - 22 January 2025
San Juan, Puerto Rico

Joint RWW/ARFTG Plenary Session

Tuesday, 23 January 2024 10:10 – 12:00


The Future of Heterogeneous Integration for mmWave Systems: Challenges and Opportunities

Speaker: Madhavan Swaminathan, The Pennsylvania State University, USA


Emerging electronic systems require the dense integration of many chiplets in either 2D or 3D form. The metrics for these systems will be dictated by power, performance, form factor, cost, and reliability. The complexity of these systems is expected to be large given the integration of sensing, wireless, computing, and other functionality on a single packaging platform that combines electronics and photonics together. Such systems pose immense integration challenges but also provide opportunities for innovation on several fronts that include architecture, design, thermal, materials, embedded intelligence, and many more? This presentation will provide a discussion of the State of the Art and opportunities for the future.


Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center.

Prior to joining Penn State University, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers.

He is the author of 550+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of 3 books and 5 book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He is the recipient of the 2024 IEEE Rao R. Tummala Electronics Packaging Award (IEEE Technical Field Award) for contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems.

He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.


Redefining ICs Metrics for OTA Characterization

Speaker: Anouk Hubrechsen, ANTENNEX B.V.


With higher frequencies, integration of antennas and RF electronics means that many measurements now need to be performed over the air. In this talk, we explain the challenges of testing RF electronics in phased-array and antenna-on-chip configurations. They require new types of testing methods. We detail the newest over-the-air measurement techniques for metrics such as noise figure, out-of-band emissions, radiated power spectrum, and field distribution in advanced, highly-integrated devices.


Anouk Hubrechsen received the B.Sc. and M.Sc. degrees in Electrical Engineering from the Eindhoven University of Technology, Eindhoven, The Netherlands, in 2017 and 2019, respectively, where she finished her Ph.D. in 2023 on reverberation-chamber measurements of mmWave antennas. She was a Guest Researcher with the National Institute of Standards and Technology at Boulder, Boulder, CO, USA, in 2018 and 2019. There she was involved in reverberation-chamber metrology for Internet-of-Things applications. She is co-founder and CEO of ANTENNEX B.V., a company that develops instrumentation for measuring integrated antenna systems, based on reverberation-chamber technology. Anouk received the Regional and District Zonta Women in Technology Awards in 2019.